Nozzle: 250 – 270 °C
Printbed: 25-50 °C
Speed: 30 – 50 mm/s
Fan: Off
PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.
PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.
PolyMide™ CoPA features Polymaker’s Warp-Free™ technology:
Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.
Nozzle Temperature: 250˚C – 270˚C
Printing Speed: 30mm/s – 50mm/s
Bed Temperature: 25˚C – 50˚C
Bed Surface: Glass with glue
Cooling Fan: OFF
Young’s Modulus: 2223 ± 199 Mpa
Tensile Strength: 66.2 ± 0.9 Mpa
Bending Strength: 97.0 ± 1.1 Mpa
Charpy Impact Strength: 9.6 ± 1.4 kJ/m2
Glass Transition Temperature: 67˚C
Vicat Softening Temperature: 180˚C
Melting Temperature: 190˚C
Drying Settings: 80˚C for 12h
Recommended Support Materials: PolyDissolve™ S1
Other:
It is highly recommended to use the PolyBox™ when printing with PolyMide™ CoPA and to store it in the resealable bag.
To ensure a good heat resistance of your printed part it is recommended to anneal your PolyMide™ CoPA 3d printed model.
Annealing settings: 70˚C for 2h
Based on 0.4 mm nozzle and Simplify 3D v.3.1. Printing conditions may vary with different printers and nozzle diameters
