Nozzle: 215 – 225 °C
Printbed: 25 – 60 °C
Speed: 30 – 40 mm/s
Fan: On
PolyDissolve™ is a family of dissolvable support filaments. This family offers support solution for our portfolio of filaments. It enables a greater design freedom.
PolyDissolve™ S2 is a dissolvable support for PC, ABS and ASA based filaments from our portfolio. It is specifically engineered to have a perfect interface with these materials while also displaying good solubility.
Material Compatibility
++ support the model very well
+ generally support the model depending on its geometry
– generally doesn’t support the model depending on its geometry
– – do not support the model
Material Adhesion with PolySupportTM
PLA based material from Polymaker’s portfolio ++
PETG based material from Polymaker’s portfolio +
ABS based material from Polymaker’s portfolio —
PC based material from Polymaker’s portfolio —
PVB based material from Polymaker’s portfolio ++
TPU based material from Polymaker’s portfolio ++
Nylon based material from Polymaker’s portfolio ++
Nozzle temperature 215 – 225 ( ̊C)
Build Surface material BuildTak®, Blue Tape
Build surface treatment None
Build plate temperature 25 – 60 ( ̊C)
Cooling fan Turned on
Printing speed 30-40 (mm/s)
Raft separation distance 0 (mm)
Retraction distance 1 (mm)
Retraction speed 20 (mm/s)
Recommended environmental temperature Room temperature
Based on 0.4 mm nozzle and Simplify 3D v.3.1. Printing conditions may vary with different nozzle diameters
It is highly recommended to use the PolyBoxTM when printing with PolyDissolveTM S1 and to store it in the resealable bag.
